Dear haile.david.amos,
Good day.
This is a courtesy email to let you know that a breakdown of multilayer boards show that it consists of 3 basic elements: thin rigid laminates, copper foils and prepregs sheets.
The prepreg has 3 main functions, that is to bond thin inner-layer laminates, to establish a dielectric spacing between copper layers and fill spaces and openings in the etched copper.
A very important issue is the practical build-up of the dielectric thickness between the circuit layers.
Comparison of different Prepreg.
Type of Prepreg | Finished Thickness | Resin Content | |
| mm | mil | % |
7628H(7630) | 0.213 | 8.4 | 50 |
7628(43%) | 0.195 | 7.6 | 43 |
7628(41%) | 0.185 | 7.3 | 41 |
2116HR | 0.135 | 5.3 | 57 |
2116 | 0.120 | 4.7 | 52 |
2113 | 0.100 | 4.0 | 56 |
1080 | 0.076 | 3.0 | 64 |
1060 | 0.050 | 2.0 | 71 |
1080=3.04mil, 2116=4.67mil, 7628=7.68mil
If you have requirement on multilayer PCB's, please do not hesitate to contact us by simply reply back to this email or following contact details. We'll get back to you ASAP.
Wish you the best in trade.
Ruth Huang | Business development
Bicheng PCB |Material partners: ITEQ, SHENGY, TAIYO, KUANGSHUN
(86-755-21949341 | www.bicheng-pcb.com | sales12@bicheng-pcb.com
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